About the role
What We're Looking For:
We're looking for photonics packaging engineers to contribute to, and own aspects of the A-0 and A-1 packages.
This role bridges the classically divided photonics and advanced packaging skillsets, and thus is an unique point in our team.
Ideal Background:
* Experience with integrated photonics package assemblies with multiple dies * Experience with integrated circuit MCM assemblies with multiple heterogeneous materials, including compound semiconductors * Understanding of photonics concepts, such as mode field diameters, mode mismatch, polarization, etc.
Nice to Have:
* Experience with large device count photonic assemblies * Experience with clear underfill * Experience with high density fiber attach * Experience with large substrate size photonic MCM assemblies * Hands-on experience with PIC design